德州仪器申请具有定向天线的半导体封装专利,提升半导体封装性能

金融界
19 Apr

金融界2025年4月19日消息,国家知识产权局信息显示,德州仪器公司申请一项名为“4980.具有定向天线的半导体封装”的专利,公开号CN119856286A,申请日期为2023年9月。专利摘要显示,在一些实例中,一种半导体封装(100)包含:半导体管芯(98);耦合到所述半导体管芯的导电部件(102);以及多层封装衬底。所述多层封装衬底包含:提供接地连接的第一水平金属层(104);在所述第一水平...

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