近日台积电(TSMC)举办了2025年北美技术论坛,公布了下一代A14制程工艺,相比于N2带来了重大进步,旨在通过提供更快的计算和更高的能效来推动人工智能(AI)转型。A14制程工艺计划2028年投产,目前的开发进展顺利,良品率比预期的要高。
A14制程工艺将采用第二代GAA晶体管,并通过NanoFlex Pro技术进一步提高灵活性。不过首发的A14制程工艺不支持超级电轨(Super Power Rail,SPR)架构,也就是背面供电技术,台积电会在2029年带来加入背面供电的版本,满足高性能客户端和数据中心应用的需求。
A14系列的主要优势之一是支持NanoFlex Pro技术,为芯片设计人员提供了灵活的标准元件,通过微调晶体管配置,以实现特定应用或工作负载的最佳性能、能耗和面积(PPA)指标。即将到来的N2支持的是NanoFlex技术,暂时不清楚NanoFlex Pro会有哪些改进,预计会带来更精确的控制。
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