本文由半导体产业纵横(ID:ICVIEWS)综合ASML第一季度订单“令人失望”。刚刚国家知识产权局信息显示,ASML荷兰有限公司取得一项名为“用于芯片接地的方法、设备和系统”的专利,授权公告号CN114287051B,申请日期为2020年8月。2023年末,三星与ASML签署了一项价值1万亿韩元的协议,双方将在韩国京畿道东滩投资建设半导体芯片研究设施,并在那里共同努力改进EUV光刻制造技术。...
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