【均联智行联合东风汽车、黑芝麻智能实现舱驾一体方案量产突破 东风多款车型搭载C1296芯片】金十数据4月24日讯，上海国际车展现场，宁波均联智行科技股份有限公司、东风汽车集团有限公司与黑芝麻智能科技有限公司共同宣布，三方联合开发的舱驾一体化方案正式进入量产阶段。基于黑芝麻智能武当C1296芯片打造的该方案，将率先搭载于东风汽车旗下多款新车型，计划于2025年内实现量产交付。作为此次量产方案的核心硬件，武当C1296芯片采用7nm车规级工艺打造，是行业首颗支持多域融合计算芯片，以创新的多域融合架构打破传统功能域边界。该芯片首次实现智能座舱、辅助驾驶、车身控制等系统的硬件级资源整合，在降低开发复杂度的同时，显著提升功能协同效率。
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