台积电(TSM.US)计划在2028年开始使用A14制造工艺进行生产,旨在保持芯片行业的领先地位。这项技术将使这家全球最大的芯片制造商超越其目前最先进的3纳米制程以及即将于今年晚些时候推出的2纳米制程。台积电还计划在2026年底推出中间阶段的A16制程。
台积电一直保持着稳定的升级步伐,这使其牢牢占据了苹果和英伟达利润丰厚的芯片制造业务。该公司预计今年的资本支出约为400亿美元,高管表示,其长期计划仍将着眼于抓住人工智能驱动的强劲需求。
周三在加州举行的公司活动上,台积电高管们公布了其路线图的新增内容,并详细介绍了它将如何帮助提高能效和性能。台积电副联席首席运营官Kevin Zhang前一天表示,他看到了行业正在发生的转变:智能手机零部件制造商过去是新生产技术的首批采用者,而人工智能的蓬勃发展使得更大型的人工智能芯片设计者更快地采用最新的创新技术。
Zhang表示,台积电仍然相信,半导体的整体需求将继续上升,到本十年末,整个行业的营收将“轻松”超过1万亿美元。尽管芯片行业普遍接受这一销售目标,但随着美国宣布对人工智能产品加征大范围关税,投资者对人工智能泡沫的担忧在最近几周有所加剧。
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