(原标题:台积电巨型芯片计划)如果您希望可以时常见面,欢迎标星收藏哦~来源:内容编译自techspot ,谢谢。随着台积电准备扩大其芯片封装技术的物理规模,半导体行业正迈向一个重要的里程碑。在最近的北美技术研讨会上,台积电详细介绍了新一代CoWoS(晶圆上芯片封装)技术的计划,该技术能够组装比目前量产的芯片尺寸大得多的多芯片处理器。如今的高端处理器,尤其是那些支持数据中心和人工智能工作负载的处理器...
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