芯片股走低，英伟达跌5%，CoWoS先进封装订单传出砍单
周一，半导体股走弱。截至发稿，费城半导体指数跌超1%，英伟达跌幅近5%，逼近2月3日以来低位。博通跌3.4%，台积电跌2.89%，Arm跌2.73%。
消息面上，供应链透露，英伟达于晶圆代工厂之CoWoS先进封装订单传出砍单，且先前洽谈委外之CoW(Chip on Wafer)前段封装制程，最终未达共识。
分析人士指出：台积电先进制程产能利用率仍接近满载，甚至高于年初产量，但随英伟达前代Hooper GPU生命周期进入尾声，总订单量可能逐渐减少，有待次世代产品GB300问世振兴需求。
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