Amkor Technology, Taiwan Semiconductor Collaborate on Advanced Packaging in Arizona

MT Newswires Live
2024-10-04

Amkor Technology (AMKR) and Taiwan Semiconductor Manufacturing (TSM) said Thursday they have agreed to collaborate on advanced packaging and testing capabilities in Arizona.

Under the agreement, Taiwan Semiconductor will utilize Amkor's turnkey advanced packaging and testing services at its planned facility in Peoria, Arizona, to support customers using Taiwan Semiconductor's wafer fabrication facilities in Phoenix, according to a joint statement.'

Financial details weren't disclosed.

Shares of Amkor Technology were up 1.4% in after-hours activity.

Price: 29.50, Change: +0.41, Percent Change: +1.41

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