US finalizes up to $407 million award to Amkor for Arizona chip packaging plant

Reuters

2024/12/21

WASHINGTON ,Dec 20 (Reuters) - The U.S. Commerce Department said on Friday it finalized an award to Amkor Technology AMKR.O of up to $407 million to help fund the company's planned $2 billion advanced semiconductor packaging facility in Arizona.

The plant is set to be the largest of its kind in the U.S. and when fully operational will package and test millions of chips for autonomous vehicles, 5G/6G and data centers. Apple AAPL.O will be its first and largest customer with the chips produced at a nearby Taiwanese chipmaker TSMC 2330.TW facility.

(Reporting by David Shepardson)

((David.Shepardson@thomsonreuters.com; 2028988324;))

免责声明：投资有风险，本文并非投资建议，以上内容不应被视为任何金融产品的购买或出售要约、建议或邀请，作者或其他用户的任何相关讨论、评论或帖子也不应被视为此类内容。本文仅供一般参考，不考虑您的个人投资目标、财务状况或需求。TTM对信息的准确性和完整性不承担任何责任或保证，投资者应自行研究并在投资前寻求专业建议。

热议股票

{"basename":"/hans","ssrTDKData":{"titleTemplate":"%s - 老虎证券","title":"老虎证券 | 轻松买卖美股港股A股/美债/ETF/Crypto/期权期货","description":"老虎证券提供多项优惠： 港股&Crypto 0佣0平台费、A股通一年免佣、美股期权0佣、IPO打新0融资利息0手续费。 美股1美元起投，免费实时行情与多种工具，立即开户享更多优惠！","keywords":"老虎证券,老虎证券开户,老虎证券香港,老虎证券登录,老虎证券官网,香港证券开户,证券公司开户,股票开户,香港证券公司,香港证券,证券公司,股票投资,投资app,投资平台,股票买卖,股票交易平台,股票app,证券app,新手投资","social":{"ogDescription":"老虎证券提供多项优惠： 港股&Crypto 0佣0平台费、A股通一年免佣、美股期权0佣、IPO打新0融资利息0手续费。 美股1美元起投，免费实时行情与多种工具，立即开户享更多优惠！","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hans/news/2493316477"},"companyName":"老虎证券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"HKG","license":"TBHK","edition":"fundamental"},"isCrawlerRequest":true,"__swrFallback__":{"@#url:\"https://stock-news.skytigris.cn/v3/news\",params:#id:\"2493316477\",edition:\"fundamental\",auth_exemption:1,,,undefined,":{"share":"https://ttm.financial/m/news/2493316477?lang=zh_CN&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2024-12-21 06:00","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2493316477","market":"us","top_or_hot":-1,"title":"US finalizes up to $407 million award to Amkor for Arizona chip packaging plant","media":"Reuters","content":"<html xmlns=\"http://www.w3.org/1999/xhtml\"><head><title>US finalizes up to $407 million award to Amkor for Arizona chip packaging plant</title></head><body><p>\n<span>WASHINGTON ,Dec 20 (Reuters)</span><span> - </span>The U.S. Commerce Department said on Friday it finalized an award to Amkor Technology <span>AMKR.O</span> of up to $407 million to help fund the company's planned $2 billion advanced semiconductor packaging facility in Arizona.</p><p>The <span>plant</span> is set to be the largest of its kind in the U.S. and when fully operational will package and test millions of chips for autonomous vehicles, 5G/6G and data centers. Apple <span>AAPL.O</span> will be its <span>first and largest customer</span> with the chips produced at a nearby Taiwanese chipmaker TSMC <span>2330.TW</span> facility.</p><p> (Reporting by David Shepardson)</p><p> ((David.Shepardson@thomsonreuters.com; 2028988324;))</p></body></html>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>US finalizes up to $407 million award to Amkor for Arizona chip packaging plant</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nUS finalizes up to $407 million award to Amkor for Arizona chip packaging plant\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1032215980\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Reuters </p>\n<p class=\"h-time\">2024-12-21 06:00</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html xmlns=\"http://www.w3.org/1999/xhtml\"><head><title>US finalizes up to $407 million award to Amkor for Arizona chip packaging plant</title></head><body><p>\n<span>WASHINGTON ,Dec 20 (Reuters)</span><span> - </span>The U.S. Commerce Department said on Friday it finalized an award to Amkor Technology <span>AMKR.O</span> of up to $407 million to help fund the company's planned $2 billion advanced semiconductor packaging facility in Arizona.</p><p>The <span>plant</span> is set to be the largest of its kind in the U.S. and when fully operational will package and test millions of chips for autonomous vehicles, 5G/6G and data centers. Apple <span>AAPL.O</span> will be its <span>first and largest customer</span> with the chips produced at a nearby Taiwanese chipmaker TSMC <span>2330.TW</span> facility.</p><p> (Reporting by David Shepardson)</p><p> ((David.Shepardson@thomsonreuters.com; 2028988324;))</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"AMKR","symbol_name":"艾马克技术公司","start_time":0,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20241220:nL1N3NL12P:1","article_id":"2493316477","we_media_id":"1032215980","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2493316477","pubTimestamp":1734732000,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Reuters","introduction":"Reuters.com brings you the latest news from around the world, covering breaking news in markets, business, politics, entertainment and technology","home_visible":1,"id":"1032215980","head_image":"https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48"},"summary":"WASHINGTON ,Dec 20  - The U.S. Commerce Department said on Friday it finalized an award to Amkor Technology AMKR.O of up to $407 million to help fund the company's planned $2 billion advanced semiconductor packaging facility in Arizona.The plant is set to be the largest of its kind in the U.S. and when fully operational will package and test millions of chips for autonomous vehicles, 5G/6G and data centers. Apple AAPL.O will be its first and largest customer with the chips produced at a nearby Taiwanese chipmaker TSMC 2330.TW facility.  ","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"AMKR":"艾马克技术公司","BK4147":"半导体设备"},"translate_title":"美国最终向Amkor授予高达4.07亿美元的亚利桑那州芯片封装工厂合同","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMKR":0.9},"content_text":"US finalizes up to $407 million award to Amkor for Arizona chip packaging plant\nWASHINGTON ,Dec 20 (Reuters) - The U.S. Commerce Department said on Friday it finalized an award to Amkor Technology AMKR.O of up to $407 million to help fund the company's planned $2 billion advanced semiconductor packaging facility in Arizona.The plant is set to be the largest of its kind in the U.S. and when fully operational will package and test millions of chips for autonomous vehicles, 5G/6G and data centers. Apple AAPL.O will be its first and largest customer with the chips produced at a nearby Taiwanese chipmaker TSMC 2330.TW facility. (Reporting by David Shepardson) ((David.Shepardson@thomsonreuters.com; 2028988324;))","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"}}}