WASHINGTON ,Dec 20 (Reuters) - The U.S. Commerce Department said on Friday it finalized an award to Amkor Technology AMKR.O of up to $407 million to help fund the company's planned $2 billion advanced semiconductor packaging facility in Arizona.
The plant is set to be the largest of its kind in the U.S. and when fully operational will package and test millions of chips for autonomous vehicles, 5G/6G and data centers. Apple AAPL.O will be its first and largest customer with the chips produced at a nearby Taiwanese chipmaker TSMC 2330.TW facility.
(Reporting by David Shepardson)
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