HANMI Semiconductor (KRX:042700) began the construction of its seventh factory to produce thermocompression (TC) bonding bonders, essential for high-bandwidth memory manufacturing, the company said Tuesday.
The two-story, 4,356 pyeong facility, near the company's existing six production sites in Seo-gu, Incheon, is slated for completion by the fourth quarter of 2025. The expanded capacity is expected to boost sales potential to around 2 trillion won, the release said.
Shares of Hanmi Semiconductor rose nearly 4% in recent trade on Wednesday.
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