Micron Technology (MU) said late Tuesday that it broke ground on a packaging unit adjacent to its facilities in Singapore to meet the growing demand for advanced memory and storage solutions induced by artificial intelligence.
While operations at the high-bandwidth memory packaging facility will likely begin in 2026, a "meaningful expansion" of packaging capacity will start in 2027, the company said.
Micron, whose current facility in Singapore is a front-end semiconductor fab, plans to invest about $7 billion through the end of the decade and beyond in high-bandwidth memory advanced packaging.
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