Jilin Sino-Microelectronics (SHA:600360) plans to mortgage some of its assets for a loan worth 180 million yuan from China Construction Bank (HKG:0939, SHA:601939) for its business development needs, according to a Shanghai Stock Exchange disclosure on Jan. 22.
The assets comprise part of the company's real estate in High-tech Zone, Jilin City, China, which has a total land area of 112,387.81 square meters and a building area of 36,512.39 square meters, and part of its production machinery and equipment.
The mortgage period is 13 months, the filing said.
免责声明:投资有风险,本文并非投资建议,以上内容不应被视为任何金融产品的购买或出售要约、建议或邀请,作者或其他用户的任何相关讨论、评论或帖子也不应被视为此类内容。本文仅供一般参考,不考虑您的个人投资目标、财务状况或需求。TTM对信息的准确性和完整性不承担任何责任或保证,投资者应自行研究并在投资前寻求专业建议。