TechInsights has released preliminary findings from their teardown analysis of NVIDIA's Blackwell HGX B200 platform, highlighting significant advancements in AI and high-performance computing within data centers. Among the noteworthy innovations, SK hynix provides high-bandwidth memory (HBM3E) for NVIDIA's GB100 graphics processing unit (GPU), which integrates TSMC's cutting-edge packaging architecture. This GPU marks the first commercial implementation of TSMC's CoWoS-L packaging technology, a leap forward in multi-die GPU configurations. As this analysis continues, it sheds light on the intricate design and technological relationships that underpin modern semiconductor advancements in AI chips.
In other trading, ASM International was trading firmly up 5.8% and ending the day at €408.00. At the same time, Disco lagged, down 8% to end trading at ¥25,990.
Doubling high-bandwidth memory revenue as data centers increase AI investments highlights SK hynix's growth potential. Discover SK hynix's strategic moves in the full company narrative.
Don't miss our Market Insights article on AI Chips, with critical analysis of DeepSeek's disruptive impact on the AI ecosystem.
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Companies discussed in this article include ENXTAM:ASM NasdaqGS:NVDA NasdaqGS:AMD NasdaqGS:QCOM NasdaqGS:INTC TWSE:2330 KOSE:A000660 and TSE:6146.
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