Ansys (ANSS) said late Wednesday that it expanded its collaboration with Taiwan Semiconductor Manufacturing (TSM) to offer new certifications for semiconductor solutions, as well as enhanced AI-assisted workflows for radio frequency design migration and photonic integrated circuits.
The partners facilitate optimized 3D integrated circuit design and expedite market readiness for AI and high-performance computing chip applications, according to the statement. The companies are also extending tool certification for the newly announced N3C technology.
免责声明：投资有风险，本文并非投资建议，以上内容不应被视为任何金融产品的购买或出售要约、建议或邀请，作者或其他用户的任何相关讨论、评论或帖子也不应被视为此类内容。本文仅供一般参考，不考虑您的个人投资目标、财务状况或需求。TTM对信息的准确性和完整性不承担任何责任或保证，投资者应自行研究并在投资前寻求专业建议。