Ansys (ANSS) said late Wednesday that it expanded its collaboration with Taiwan Semiconductor Manufacturing (TSM) to offer new certifications for semiconductor solutions, as well as enhanced AI-assisted workflows for radio frequency design migration and photonic integrated circuits.

The partners facilitate optimized 3D integrated circuit design and expedite market readiness for AI and high-performance computing chip applications, according to the statement. The companies are also extending tool certification for the newly announced N3C technology.